College of Engineering, Design & Computing Events

Concept papers due 12 April | CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

NIST

This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. Through this NOFO, the NAPMP program seeks to achieve the following objectives: 

• Accelerate domestic R&D and innovation in advanced packaging materials and substrates; 
• Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security; 
• Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and 
• Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.