College of Engineering, Design & Computing Events

DARPA

This Microsystems Exploration Topic will seek to develop an accurate and computationally efficient multi-scale thermal modeling framework for deeply-scaled emerging transistors for very large-scale integration, under both steady-state and transient modes of operation (0.1 ns to 1 ns timescales). Length scales of interest include individual transistors to representative functional circuit blocks. Targeted prediction uncertainty is 1 oC in maximum temperature, with >1000X reduction in computational effort compared to the SoA. Furthermore, thermal properties and interfacial thermal resistances predicted by the framework will be within 1% of atomistic approaches.