College of Engineering, Design & Computing Events

Low Temperature Logic Technology

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Low Temperature Logic Technology
DARPA
Solicits research proposals for the development of low temperature (77K) FinFET technology to achieve a 25X improvement in the performance/power of state-of-the-art central processing units compared to room temperature operation.

College of Engineering, Design and Computing

CU Denver

North Classroom

1200 Larimer Street

Suite 3034

Denver, CO 80204


303-315-7170

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